Designed for the OEM assembly of difficult-to-bond materials which require uniform stress distribution
Particularly suited for bonding porous or absorbent materials
No-run viscosity for large gaps and vertical surfaces
| Format | 10.58 oz. |
| Container Type | Cartridge |
| Colour | Clear |
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| No. of compartments | 1 |
| Physical Form | Gel |
| Gap Fill | 0.01" |
| Full Cure Temperature | 25°C |
| Substrates | 25°C |
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